Notebook

Notebook Application poi↔₩××nt

Model of application producε✘ts

Application Glue Model Characteristic
Narrow frame bonding PUR JT8020, JT8402B High bond strength to all​$≤ substrates, good cree✘☆$₩p resistance at elevated tempera"®tures
Shell bonding MMA JT6743 Fast curing at room temperature,¶®✔♦ good aging resistance, high₹©₹ bond strength to all s λ®ubstrates
Camera Module Application epoxy, acrylate JT5113, JT6094, JT6301Bβ∑ High bond strength to↑™ all substrates, especially LCP/™★Ni, low glue extraction, low cuβ€§™re shrinkage
Speaker/Headset Bonding Acrylate, Epoxy, Acrylate JT3310, JT5102S2, JT6£π≥069 High bond strength to Ni/Zn, good ag÷♣≥ing resistance
Battery BMS Protection epoxy, acrylate JT5801, JT6452 JT5801 has good flowability at room te'" mperature, stable electrical conducti‍ •σvity and good aging resi✔↓♥>stance
Touchpad Application epoxy JT6426 First activated with UV lig∞☆φαht of wavelength 254-40←™5nm, then finally cured at room t♦₽λ>emperature for 24 hours, exce÷$llent impact resistance
Hardware Application Acrylate, Epoxy JT3310, JT5308 High temperature resistance, excellent∞σ♥≠ impact resistance, good♠©∑← aging resistance
PCBA Protection Acrylate JT6062, JT6452 Good aging resistance, excellen↓"t sweat resistance
in shaded areas JT6062÷Ω☆∑ can be moisture cured
Screw lock Acrylate JT3310 High bond strength to zinφ<c chromate and nickel plated surfaces,£  excellent moisture re☆<✘Ωsistance (eg 85 °C ¥δ‌/85%RH for 7 days)
Thermal Silicon Silica gel JT1202 Neutral, non-corrosive
thermal conductivity to conven'♣tional metals
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