Application | Glue | Model | Characteristic |
---|---|---|---|
Narrow frame bonding | PUR | JT8020, JT8402B | High bond strength to all$≤ substrates, good cree✘☆$₩p resistance at elevated tempera"®tures |
Shell bonding | MMA | JT6743 | Fast curing at room temperature,¶®✔♦ good aging resistance, high₹©₹ bond strength to all s λ®ubstrates |
Camera Module Application | epoxy, acrylate | JT5113, JT6094, JT6301Bβ∑ | High bond strength to↑™ all substrates, especially LCP/™★Ni, low glue extraction, low cuβ€§™re shrinkage |
Speaker/Headset Bonding | Acrylate, Epoxy, Acrylate | JT3310, JT5102S2, JT6£π≥069 | High bond strength to Ni/Zn, good ag÷♣≥ing resistance |
Battery BMS Protection | epoxy, acrylate | JT5801, JT6452 | JT5801 has good flowability at room te'" mperature, stable electrical conducti •σvity and good aging resi✔↓♥>stance |
Touchpad Application | epoxy | JT6426 | First activated with UV lig∞☆φαht of wavelength 254-40←™5nm, then finally cured at room t♦₽λ>emperature for 24 hours, exce÷$llent impact resistance |
Hardware Application | Acrylate, Epoxy | JT3310, JT5308 | High temperature resistance, excellent∞σ♥≠ impact resistance, good♠©∑← aging resistance |
PCBA Protection | Acrylate | JT6062, JT6452 | Good aging resistance, excellen↓"t sweat resistance in shaded areas JT6062÷Ω☆∑ can be moisture cured |
Screw lock | Acrylate | JT3310 | High bond strength to zinφ<c chromate and nickel plated surfaces,£ excellent moisture re☆<✘Ωsistance (eg 85 °C ¥δ/85%RH for 7 days) |
Thermal Silicon | Silica gel | JT1202 | Neutral, non-corrosive thermal conductivity to conven'♣tional metals |